Method for manufacturing a transistor having a sharp junction by forming raised source-drain regions before forming gate regions and corresponding transistor produced by said method

ABSTRACT

A transistor is fabricated by growing an epitaxial layer of semiconductor material on a semiconductor layer and forming an opening extending through the epitaxial layer at the gate location. This opening provides, from the epitaxial layer, a source epitaxial region on one side of the opening and a drain epitaxial region on an opposite side of the opening. The source epitaxial region and a first portion of the semiconductor layer underlying the source epitaxial region are annealed into a single crystal transistor source region. Additionally, the drain epitaxial region and a second portion of the semiconductor layer underlying the drain epitaxial region are annealed into a single crystal transistor drain region. A third portion of the semiconductor layer between the transistor source and drain regions forms a transistor channel region. A transistor gate electrode is then formed in the opening above the transistor channel region.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 15/597,337, filed May 17, 2017, now abandoned, which is a divisional of U.S. patent application Ser. No. 14/887,814 filed Oct. 20, 2015, now U.S. Pat. No. 9,685,456, which claims priority to both U.S. Provisional Application for Patent No. 62/214,314 filed Sep. 4, 2015 and U.S. Provisional Application for Patent No. 62/241,983 filed Oct. 15, 2015, the disclosures of all of which are hereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to integrated circuits and, in particular, to a field effect transistor (FET) device.

BACKGROUND

Techniques for the fabrication of field effect transistor (FET) devices are well known to those skilled in the art. For a conventional planar device, the process for device fabrication will typically form a gate stack over a substrate and then use the gate stack as a mask for the implantation of the source-drain regions on either side of the gate stack. It is further known in the art to subsequently use epitaxial growth to produce raised source-drain regions. The gate stack may comprise the actual gate electrode (as known in a technique referred to as “gate first” fabrication) or comprise a dummy gate (as known in a technique referred to as “gate last” or replacement metal gate (RMG) fabrication).

As the technology node continues to shrink, the scaling of the FET devices requires higher mobilities in the transistor channel region. Additionally, aggressively scaled FET devices further require a very sharp junction between the source-drain region and the channel region. The conventional processes described above for device fabrication, however, have a number of issues which become more significant as device sizes shrink. For example, it is difficult to provide a fully strained channel with high mobility for both n-channel and p-channel devices. Another issue concerns the formation of diffused junctions which degrade short channel control. Another issue with diffused junctions is an increase in resistance in the extension region of the transistor device resulting in reduced device performance. Another issue relates to pitch scaling which can introduce challenges in block level patterning. It is also recognized that resist residues at tight pitches necessitate the use of high energy extension implants, and these implants can worsen the diffused junction concerns noted above.

A need accordingly exists in the art for an improved transistor device manufacturing process that addresses the foregoing and other issues and provides a high mobility channel region and a sharp junction between the source-drain region and the channel region.

SUMMARY

In an embodiment, a method comprises: on a bulk substrate, repeating epitaxial processes to grow a first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers; epitaxially growing a defect free and fully stress released semiconductor layer on top of an uppermost one of the semiconductor defect cap layers in the first stack, the defect free and fully stress released semiconductor layer having a first thickness; on the defect free and fully stress released semiconductor layer, repeating epitaxial processes to grow a second stack of alternating indium-phosphorous and indium-gallium-arsenic layers; epitaxially growing a further indium-gallium-arsenic layer on top of an uppermost one of the indium-gallium-arsenic layers in the second stack; and doping the further indium-gallium-arsenic layer with a Group IV or Group VI dopant.

In an embodiment, a method comprises: on a bulk substrate, repeating epitaxial processes to grow a first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers; epitaxially growing a defect free and fully stress released semiconductor layer on top of an uppermost one of the semiconductor defect cap layers in the first stack, the defect free and fully stress released semiconductor layer having a first thickness; on the defect free and fully stress released semiconductor layer, repeating epitaxial processes to grow a second stack of alternating indium-phosphorous and indium-gallium-arsenic layers; epitaxially growing a strained silicon layer on top of an uppermost one of the indium-gallium-arsenic layers in the second stack; and doping the strained silicon layer.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the embodiments, reference will now be made by way of example only to the accompanying figures in which:

FIGS. 1-12 illustrate process steps in the formation of a substrate which supports a high mobility channel region for both p-channel and n-channel transistor devices;

FIGS. 13-20 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate as shown in FIG. 12;

FIG. 21 illustrates a simplified representation the substrate shown in FIG. 12;

FIGS. 22-27 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate as shown in FIG. 21;

FIGS. 28-31 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate as shown in FIG. 21;

FIGS. 32-39 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region;

FIGS. 40-49 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region; and

FIGS. 50-55 illustrate process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region.

DETAILED DESCRIPTION OF THE DRAWINGS

Reference is now made to FIGS. 1-12 which illustrate the process steps in the formation of a substrate which supports a high mobility channel for both p-channel and n-channel transistor devices. It will be understood that the drawings do not necessarily show features drawn to scale.

FIG. 1 shows a bulk substrate 100 for example made of silicon. The bulk substrate 100 may, if desired, be doped as desired for the transistor application.

An epitaxial growth process is then performed to grow an epitaxial silicon-germanium (SiGe) layer 102 a on the bulk substrate 100. The layer 102 a comprises a stress release buffer layer having a thickness of, for example, 10-500 nm with a germanium content of 25-85%. An epitaxial growth process is then performed to grow a silicon layer 104 a on the epitaxial silicon-germanium layer 102 a. The layer 104 a comprises a defect cap layer having a thickness of, for example, 50-100 nm. The epitaxial processes are repeated to deposit an epitaxial silicon-germanium layer 102 b on silicon layer 104 a and deposit a silicon layer 104 b on the epitaxial silicon-germanium layer 102 b (these layers having the same properties as the layers 102 a and 104 a). Although two repetitions of the epitaxial processes are described above and shown in FIG. 1, it will be understood that this is by example only and that any desired number of stacked epitaxial layers 102/104 may be used. A top epitaxial silicon-germanium layer 106 is then grown using an epitaxial growth process on the silicon layer 104 b. The layer 106 is a defect free and fully stress released layer having a thickness of, for example, 10-2000 nm. The result is shown in FIG. 2.

Using a wafer bonding technique as is well known in the art and similar to the process used to form silicon-on-insulator (SOI) wafers, a wafer 109 including an insulator layer 110 and a semiconductor layer 112 is bonded to the layer 106. The insulator layer 110 may, for example, comprise any suitable insulator film material possessing a high selective removal rate relative to silicon-germanium or germanium. For example, the layer 110 is preferably an oxide such as SiGeO or GeO. The layer 112 may have a thickness of 5-200 nm. The semiconductor layer 112 may, for example, have a thickness of 10-200 nm and comprise silicon-germanium (with a germanium content of 25-85%) or germanium. The result is shown in FIG. 3.

A hard mask 114 is deposited over a first active area 20 reserved for the formation of first polarity (for example, p-channel) metal oxide semiconductor devices (PMOS). A reactive ion etch (RIE) is then performed to remove the layers 110 and 112, as well as remove a portion of the layer 106, in a second active area 22 reserved for the formation of second, opposite, polarity (for example, n-channel) metal oxide semiconductor devices (NMOS). The result is shown in FIG. 4. The partial recessing of the layer 106 may, for example, be to a depth of 100-1500 nm.

A silicon-nitride spacer 116 is then formed on the exposed sidewalls of the layers 106, 110 and 112 and mask 114 between the active areas 20 and 22. The spacer 116 may, for example, be formed using a plasma-enhanced chemical vapor deposition (PECVD) process or high density plasma chemical vapor deposition (HDPCVD) process and have a thickness of 30-150 nm. The result is shown in FIG. 5.

An epitaxial growth process is then performed to grow an epitaxial indium-phosphorous layer 120 a (InP) on the layer 106 in the second active area 22. An epitaxial growth process is then performed to grow an epitaxial indium-gallium-arsenic layer 122 a (InGaAs) on the layer 120 a. The layers 120 a, 122 a form stress release buffer layers. The epitaxial processes are repeated to deposit an epitaxial indium-phosphorous layer 120 b on layer 122 a and deposit an indium-gallium-arsenic layer 122 b on the layer 120 b (these layers having the same properties as the layers 120 a and 122 a). The layers 120 a and 120 b may have a thickness of, for example, 5-500 nm. The layer 122 a may have a thickness of, for example, 5-500 nm. The layer 122 b is a defect free layer and may have a thickness of, for example, 5-800 nm. A top surface of the layer 122 b is preferably substantially co-planar with a top surface of the layer 112 in the first active area 20. The result is shown in FIG. 6. Although two repetitions of the epitaxial processes are described above and shown in FIG. 6, it will be understood that this is by example only and that any desired number of stacked epitaxial layers 120/122 may be used.

An epitaxial growth process is then performed to grow an indium-gallium-arsenic layer 124 (InGaAs) on the layer 122 b in the second active area 22. The layer 124 is doped with silicon (Si) using either an in situ process during epitaxy or an implant process after epitaxy. As an alternate to silicon dopant, any suitable Group IV (Ge or Sn) or Group VI (S, Se, Te) dopant may instead be used. In an embodiment, the dopant concentration may comprise 1×10¹⁹ to 5×10²⁰ at/cm³. The layer 124 may, for example, have a thickness of 10-100 nm. The result is shown in FIG. 7. As an alternative, strained silicon could be used for layer 124 if its mobility were satisfactory for the transistor application, and in such a case the dopant would preferably comprise phosphorous. However, InGaAs/Si is preferred due to its higher electron mobility.

A hard mask material is then deposited on the wafer. A chemical mechanical polishing (CMP) process is performed to planarize the top surface and leave a hard mask 126 over the second active area 22. The result is shown in FIG. 8.

The hard mask 114 is then removed using a selected reactive ion etch (ME) process that stops at the layer 112. The result is shown in FIG. 9.

An epitaxial growth process is then performed to grow a silicon-germanium layer 128 (SiGe) on the layer 112 in the first active area 20. The layer 128 is doped with boron using an in situ process during epitaxy. In an embodiment, the dopant concentration may comprise 1×10¹⁹ to 2×10²⁰ at/cm³. The layer 128 may, for example, have a thickness of 10-100 nm. A chemical mechanical polishing (CMP) process may be performed to remove the mask 126 and planarize the top surface so that the top surfaces of the layers 124 and 128 are coplanar. The result is shown in FIG. 10.

Shallow trench isolation (STI) structures 18 are then formed to delimit and isolate the first and second active areas 20 and 22. The result is shown in FIG. 11. It will be noted that STI structures 18 may be an optional inclusion if the silicon-nitride spacer 116 will be sufficient structurally for providing insulation and anchoring of the structural layers following the next step.

Access is made, for example through an etched opening, to the layers 110 and 120 b. A selective removal process (for example, comprising a selective etch process) is then performed through the access to selectively remove the materials forming the layers 110 and 120 b to leave a cavity 130 between the layers 106 and 112 in the first active area 20 and a cavity 132 between the layers 122 a and 122 b in the second active area 22. In an embodiment, a buffered hydrofluoric (BHF) acid etch may be used to remove SiGeO or GeO of layer 110 selectively relative to the SiGe of layers 106 and 112. In an embodiment, an H₃PO₄:HCl (3:1) etch may be used to remove InP of layer 120 b selectively relative to the InGaAs of layers 122 a and 122 b. In this context, the each of the cavities 130 and 132 is a vacant space in the wafer that may be filled with air or a noble gas such as Ne or Ar depending on the process environment. Because of the removal of the layers 110 and 120 b, it is important that the STI structures 18 (or silicon-nitride spacers 116) function as anchoring structures to support the peripheral edges of the layers 112, 122 b, 124 and 128 suspended above the cavities 130 and 132. The result is shown in FIG. 12 to provide a substrate 100′ formed by the layers previously described and located below the cavities 130 and 132.

Reference is now made to FIGS. 13-20 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate 100′ as shown in FIG. 12. It will be understood that the drawings do not necessarily show features drawn to scale.

A layer 136 of sacrificial material is deposited over the substrate 100′ wafer. The layer 136 covers the epitaxial layers 124 and 128 and the STI structures 18. If the layer 136 as deposited does not have a planar top surface, a conventional chemical-mechanical polishing (CMP) technique may be used to provide a planar top surface. The layer 136 may, for example, have a thickness of 40-400 nm. The layer 136 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 136 may, for example, comprise doped or undoped polysilicon. The result is shown in FIG. 13.

Using conventional lithographic processing techniques, the layer 136 is patterned to define a dummy gate 144 at each active region. The dummy gates 144 may, for example, be formed using a reactive ion etch (ME). The dummy gates 144 may have a length of 10-80 nm and a width of 10-80 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 14.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 148 on the side walls of each dummy gate 144. The result is shown in FIG. 15. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 148 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A layer 138 of dielectric material is then deposited over the wafer. The layer 138 covers the dummy gates 144, sidewall spacers 148, the epitaxial layers 124 and 128 and the STI structures 18. The layer 138 may, for example, have a thickness of 40-400 nm. The layer 138 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 138 may, for example, comprise silicon dioxide. A conventional chemical-mechanical polishing (CMP) technique is used to remove excess portions of layer 138 and provide a planar top surface coincident with the top of the dummy gate 144. The result is shown in FIG. 16.

The dummy gate 144 is then selectively removed using a reactive ion etch (RIE) or wet etch or combination process to form openings 150. The result is shown in FIG. 17.

A directional etch, such as a reactive ion etch (RIE), is then performed to extend the opening 150 as opening 150 a through the epitaxial layers 124 and 128 stopping on the layers 112 and 122 b (such that sides of opening 150 a are aligned with sides of opening 150). The result is shown in FIG. 18 to produce, from the epitaxial layers 124 and 128, a source epitaxial region on one side of the opening 150 a and a drain epitaxial region on the opposite side of the opening 150 a. The source and drain epitaxial regions are generally indicated at reference 52.

A laser annealing process is performed to combine the source and drain epitaxial regions 52 and an underlying portion of the layers 112 and 122 b together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping into regions 60 of single crystal material. The portions of the layers 112 and 122 b that remain after the annealing process define channel regions 62 that are fully strained to support high mobility. The result is shown in FIG. 19. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In a preferred implementation, the portions of the layers 112 and 122 b below the source and drain epitaxial regions 52 are fully converted to single crystal throughout their thickness to the cavities 130 and 132. The p-n junction with the channel region in the layers 112 and 122 b is defined by a substantially vertical junction interface portion 64 extending for a depth less than the thickness of layers 112 and 122 b and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than five degrees with respect to a straight line extending perpendicular to a rear surface of the substrate 10. The cavities 130 and 132 advantageously effectively prevent short channel effects and prevent current leakage when the transistor is in the off state.

The openings 150 and 150 a are then filled with the gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 20. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that sidewall spacer 148 sits on top of the raised source-drain regions 60. In other words, a bottom-most surface of the sidewall spacer 148 is in contact with a top-most surface of the raised source-drain regions 60. The opening 150 a permits the gate electrode (defined by metal 74/76) to penetrate to a depth below the top-most surface of the raised source-regions. In this area of penetration, the gate electrode is insulated from the raised source-drain regions 60, both laterally and vertically, solely by the high-K dielectric layer 72.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

Reference is now made to FIG. 21 which illustrates in a simplified representation the substrate 100′ shown in FIG. 12 which supports a high mobility channel for both p-channel and n-channel transistor devices. The substrate 100′ includes a substrate region 101 which presents a simplified representation of the layers/structures identified by reference numbers 100, 102 a, 104 a, 102 b, 104 b, 106, 120 a and 122 a in FIG. 12 (i.e., all structures in the substrate below the cavities 130 and 132). The substrate 100′ further includes, above the cavities 130 and 132, the layers 112, 122 b, 124 and 128. The active areas 20 and 22 are delimited by the STI structures 18.

Reference is now made to FIGS. 22-27 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate 100′ as shown in FIG. 21. It will be understood that the drawings do not necessarily show features drawn to scale.

The process starts with the substrate 100′ wafer as shown in FIG. 21. A layer 38 of dielectric material is deposited over the wafer. The layer 38 covers the epitaxial layers 124 and 128 and the STI structures 18. If the layer 38 as deposited does not have a planar top surface, a conventional chemical-mechanical polishing (CMP) technique may be used to provide a planar top surface. The layer 38 may, for example, have a thickness of 40-400 nm. The layer 38 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 38 may, for example, comprise silicon dioxide. The result is shown in FIG. 22.

Using conventional lithographic processing techniques, an opening 44 is formed in the layer 38 at each active region. The opening 44 may, for example, be formed using a reactive ion etch (RIE). The opening 44 may have a length of 10-80 nm and a width of 10-80 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 23.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 48 on the side walls of each opening 44. The result is shown in FIG. 24 with an opening 50 formed between opposite sidewall spacers 48. The opening 50 may, for example, have a length of 10-80 nm and a width of 10-80 nm. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 48 and define opening 50 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A directional etch, such as a reactive ion etch (RIE), is then performed to extend the opening 50 as opening 50 a through the epitaxial layers 124 and 128 stopping on the layers 112 and 122 b (such that sides of opening 50 a are aligned with sides of opening 50). The result is shown in FIG. 25 to produce, from the epitaxial layers 124 and 128, a source epitaxial region on one side of the opening 50 a and a drain epitaxial region on the opposite side of the opening 50 a. The source and drain epitaxial regions are generally indicated at reference 52.

A laser annealing process is performed to combine the source and drain epitaxial regions 52 and an underlying portion of the layers 112 and 122 b together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping into regions 60 of single crystal material. The portions of the semiconductor layers 16 p and 16 n that remain after the anneal process define channel regions 62 that are fully strained to support high mobility. The result is shown in FIG. 26. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In a preferred implementation, the portions of the layers 112 and 122 b below the source and drain epitaxial regions 52 are fully converted by the anneal to single crystal throughout their thickness to the cavities 130 and 132. The p-n junction with the channel region in the epitaxial layers 124 and 128 is defined by a substantially vertical junction interface portion 64 extending for a depth less than the thickness of layers 112 and 122 b and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion 64 in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than five degrees with respect to a straight line extending perpendicular to a rear surface of the substrate 100′. The cavities 130 and 132 advantageously effectively prevent short channel effects and prevent current leakage when the transistor is in the off state.

The openings 50 and 50 a are then filled with a gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 27. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that the sidewall spacer 48 sits on top of the raised source-drain regions 60. In other words, a bottom-most surface of the sidewall spacer 48 is in contact with a top-most surface of the raised source-drain regions 60. The opening 50 a permits the gate electrode (defined by metal 74/76) to penetrate to a depth below the top-most surface of the raised source-regions. In this area of penetration, the gate electrode is insulated from the raised source-drain regions 60, both laterally and vertically, solely by the high-K dielectric layer 72.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

Reference is now made to FIGS. 28-31 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the high mobility channel region provided by a substrate 100′ as shown in FIG. 21. It will be understood that the drawings do not necessarily show features drawn to scale.

The process starts with the substrate 100′ wafer as shown in FIG. 21. Using conventional lithographic processing techniques, an opening 244 is formed in the epitaxial layers 124 and 128 at each active region stopping on the layers 112 and 122 b. The opening 244 may, for example, be formed using a reactive ion etch (RIE). The opening 244 may have a length of 10-80 nm and a width of 10-60 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 28 to produce, from the epitaxial layers 124 and 128, a source epitaxial region on one side of the opening 244 and a drain epitaxial region on the opposite side of the opening 244. The source and drain epitaxial regions are generally indicated at reference 52.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 248 on the side walls of each opening 244. The result is shown in FIG. 29 with an opening 250 formed between opposite sidewall spacers 248. The opening 250 may, for example, have a length of 5-40 nm and a width of 5-40 nm. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 248 and define opening 150 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A laser annealing process is then performed to combine the source and drain epitaxial regions 52 and an underlying portion of the layers 112 and 122 b together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping into regions 60 of single crystal material. The portions of the layers 112 and 122 b that remain after the anneal define channel regions 62 that are fully strained to support high mobility. The result is shown in FIG. 30. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In a preferred implementation, the portions of the layers 112 and 122 b below the source and drain epitaxial regions 52 are fully converted to single crystal throughout their thickness to the cavities 130 and 132. The p-n junction with the channel region in the layers 112 and 122 b is defined by a substantially vertical junction interface portion 64 extending for a depth less than the thickness of layers 112 and 122 b and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than 5° with respect to a straight line extending perpendicular to a rear surface of the substrate 10. The cavities 130 and 132 advantageously effectively prevent short channel effects and prevent current leakage when the transistor is in the off state.

The opening 250 is then filled with the gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 31. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that sidewall spacer 248 laterally (horizontally) separates the gate electrode (defined by metal 74/76) from the raised source-drain regions 60. In this configuration, a bottom-most surface of the sidewall spacer 248 is in contact with an intermediate surface of the source-drain regions 60 (defined by opening 250), said intermediate surface being between a top-most surface and bottom-most surface of the source-drain regions. Furthermore, with opening 250, the gate electrode is vertically separated (insulated) from the raised source-drain regions 60 at said intermediate surface by only the high-K dielectric layer 72.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

The process of FIGS. 1-12 shows one method for achieving a substrate 100′ having a stress-released layers 112 and 122 b surmounted by epitaxial layers 124 and 128 with underlying cavities 130 and 132 for supporting PMOS and NMOS transistor fabrication of CMOS circuitry. The transistor circuit fabrication processes of FIGS. 13-20, FIGS. 22-27 and FIGS. 28-31 may be implemented using any suitably formed substrate 100′ made using the process of FIGS. 1-12 or using some other process.

Reference is now made to FIGS. 32-39 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region. It will be understood that the drawings do not necessarily show features drawn to scale.

FIG. 32 shows a silicon on insulator (SOI) semiconductor substrate 10 comprising a semiconductor substrate 12, an insulating layer 14 and a semiconductor layer 16 in a stack of a wafer. The semiconductor layer 16 may, for example, have a thickness of 10-100 nm. The insulating layer 14 is commonly referred to in the art as a buried oxide (BOX) layer. The semiconductor layer 16 is strained as needed for high mobility performance (for example, in accordance with the technique described above in connection with FIGS. 1-12 to provide layers 112 and 122 b). Shallow trench isolation (STI) structures 18 are provided to delimit active areas of the substrate 10. The substrate 10 includes a first active area 20 reserved for the formation of first polarity (for example, p-channel) metal oxide semiconductor devices (PMOS) and a second active area 22 reserved for the formation of second, opposite, polarity (for example, n-channel) metal oxide semiconductor devices (NMOS). The STI structures 18 may be provided to extend with an exposed height of 5-50 nm above the top surface of the semiconductor layer 16. The provision of the STI structures 18 divides the semiconductor layer 16 in accordance with the active areas to provide a semiconductor layer 16 p (see, also, layer 112) for the PMOS devices and a semiconductor layer 16 n (see, also, layer 122 b) for the NMOS devices. In an embodiment, the semiconductor layer 16 p may comprise a germanium material, a silicon material, or a silicon germanium material. The semiconductor layer 16 n may comprise a silicon material. The semiconductor layers 16 p and 16 n may be doped as desired for the transistor application.

An epitaxial growth process is then performed to grow an epitaxial silicon-germanium (SiGeB) region 30 on the semiconductor layer 16 p and grow an epitaxial silicon or silicon carbon region (SiP/Si:CP) 32 on the semiconductor layer 16 n. The result is shown in FIG. 33. The regions 30 and 32 may, for example, have a thickness of 5-40 nm, and this thickness is preferably less than or equal to the exposed height of the STI structures 18. An in-situ Boron doped (ISBD) epitaxy may be used to form the epitaxial silicon-germanium region 30. The Boron dopant may be in the range of 1×10¹⁹ at/cm³ to 2×10²¹ at/cm³. Substitutional Germanium at 25% to 75% may be provided. An in-situ Phosphorous doped (ISPD) epitaxy may be used to form the epitaxial silicon or silicon-carbon region 32. The Phosphorous dopant may be in the range of 1×10¹⁹ at/cm³ to 1×10²¹ at/cm³. Substitutional Carbon at 0.5% to 5% may be provided.

As an alternative to strained silicon for the region 32, an epitaxial growth of indium-gallium-arsenic (InGaAs) may instead be made. The InGaAs region 32 may be doped with silicon (Si) using either an in situ process during epitaxy or an implant process after epitaxy. As an alternate to silicon dopant, any suitable Group IV (Ge or Sn) or Group VI (S, Se, Te) dopant may instead be used. In an embodiment, the dopant concentration may comprise 1×10¹⁹ to 5×10²⁰ at/cm³. The InGaAs/Si material may exhibit superior electron mobility in comparison to strained silicon.

A layer 38 of dielectric material is then deposited over the wafer. The layer 38 covers the epitaxial regions 30 and 32 and the STI structures 18. If the layer 38 as deposited does not have a planar top surface, a conventional chemical-mechanical polishing (CMP) technique may be used to provide a planar top surface. The layer 38 may, for example, have a thickness of 40-400 nm. The layer 38 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 38 may, for example, comprise silicon dioxide. The result is shown in FIG. 34.

Using conventional lithographic processing techniques, an opening 44 is formed in the layer 38 at each active region. The opening 44 may, for example, be formed using a reactive ion etch (RIE). The opening 44 may have a length of 10-80 nm and a width of 10-80 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 4.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 48 on the side walls of each opening 44. The result is shown in FIG. 36 with an opening 50 formed between opposite sidewall spacers 48. The opening 50 may, for example, have a length of 10-80 nm and a width of 10-80 nm. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 48 and define opening 50 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A directional etch, such as a reactive ion etch (RIE), is then performed to extend the opening 50 as opening 50 a through the epitaxial regions 30 and 32 stopping on the semiconductor layers 16 p and 16 n (such that sides of opening 50 a are aligned with sides of opening 50). The result is shown in FIG. 37 to produce, from the epitaxial regions 30 and 32, a source epitaxial region on one side of the opening 50 a and a drain epitaxial region on the opposite side of the opening 50 a. The source and drain epitaxial regions are generally indicated at reference 52.

A laser annealing process is then performed to combine the source and drain epitaxial regions 52 and an underlying portion of the semiconductor layers 16 p and 16 n together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping into regions 60 of single crystal material. The portions of the semiconductor layers 16 p and 16 n that remain after the anneal define channel regions 62. The result is shown in FIG. 38. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In a preferred implementation, the portions of the semiconductor layers 16 p and 16 n below the epitaxial regions 30 and 32 are fully converted to single crystal throughout their thickness to the upper surface of the insulating layer 14. The p-n junction with the channel region in the semiconductor layers 16 p and 16 n is defined by a substantially vertical junction interface portion 64 extending for a depth less than the layer 16 thickness and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion 64 in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than five degrees with respect to a straight line extending perpendicular to a rear surface of the substrate 10.

The openings 50 and 50 a are then filled with the gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 39. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that the sidewall spacer 48 sits on top of the raised source-drain regions 60. In other words, a bottom-most surface of the sidewall spacer 48 is in contact with a top-most surface of the raised source-drain regions 60. The opening 50 a permits the gate electrode (defined by metal 74/76) to penetrate to a depth below the top-most surface of the raised source-regions. In this area of penetration, the gate electrode is insulated from the raised source-drain regions 60, both laterally and vertically, solely by the high-K dielectric layer 72.

In an embodiment, the insulating layer 14 may be selectively removed to produce cavities (like the cavities 130 and 132 discussed above) under the regions 16 p and 16 n.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

The CMOS transistor circuits shown in FIGS. 27 and 39 present a number of advantages including: a) a single inner spacer for both the PMOS and the NMOS with relatively large gate metal contact area; b) a low resistance extension with the thick epitaxial regions; c) a fully strained channel with high carrier mobility; d) formation of the raised source-drain regions before gate patterning provide uniform raised source-drain across various different pitches and simplifies dual epitaxial integration; and e) good control of channel thickness with respect to the SOI substrate (which can be of the extremely thin silicon on insulator (ETSOI) or ultra-thin body and BOX (UTBB) type known in the art).

Reference is now made to FIGS. 40-49 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region. It will be understood that the drawings do not necessarily show features drawn to scale.

FIG. 40 shows a silicon on insulator (SOI) semiconductor substrate 10 comprising a semiconductor substrate 12, an insulating layer 14 and a semiconductor layer 16 in a stack of a wafer. The semiconductor layer 16 may, for example, have a thickness of 10-100 nm. The insulating layer 14 is commonly referred to in the art as a buried oxide (BOX) layer. The semiconductor layer 16 is strained as needed for high mobility performance (for example, in accordance with the technique described above in connection with FIGS. 1-12 to provide layers 112 and 122 b). Shallow trench isolation (STI) structures 18 are provided to delimit active areas of the substrate 10. The substrate 10 includes a first active area 20 reserved for the formation of first polarity (for example, p-channel) metal oxide semiconductor devices (PMOS) and a second active area 22 reserved for the formation of second, opposite, polarity (for example, n-channel) metal oxide semiconductor devices (NMOS). The STI structures 18 may be provided to extend with an exposed height of 5-50 nm above the top surface of the semiconductor layer 16. The provision of the STI structures 18 divides the semiconductor layer 16 in accordance with the active areas to provide a semiconductor layer 16 p (see, also, layer 112) for the PMOS devices and a semiconductor layer 16 n (see, also, layer 122 b) for the NMOS devices. In an embodiment, the semiconductor layer 16 p may comprise a germanium material, a silicon material, or a silicon germanium material. The semiconductor layer 16 n may comprise a silicon material. The semiconductor layers 16 p and 16 n may be doped as desired for the transistor application.

An epitaxial growth process is then performed to grow an epitaxial silicon-germanium (SiGeB) region 30 on the semiconductor layer 16 p and grow an epitaxial silicon or silicon carbon region (SiP/Si:CP) 32 on the semiconductor layer 16 n. The result is shown in FIG. 41. The regions 30 and 32 may, for example, have a thickness of 5-40 nm, and this thickness is preferably less than or equal to the exposed height of the STI structures 18. An in-situ Boron doped (ISBD) epitaxy may be used to form the epitaxial silicon-germanium region 30. The Boron dopant may be in the range of 1×10¹⁹ at/cm³ to 2×10²¹ at/cm³. Substitutional Germanium at 25% to 75% may be provided. An in-situ Phosphorous doped (ISPD) epitaxy may be used to form the epitaxial silicon or silicon-carbon region 32. The Phosphorous dopant may be in the range of 1×10¹⁹ at/cm³ to 1×10²¹ at/cm³. Substitutional Carbon at 0.5% to 5% may be provided.

As an alternative to strained silicon for the region 32, an epitaxial growth of indium-gallium-arsenic (InGaAs) may instead be made. The InGaAs region 32 may be doped with silicon (Si) using either an in situ process during epitaxy or an implant process after epitaxy. As an alternate to silicon dopant, any suitable Group IV (Ge or Sn) or Group VI (S, Se, Te) dopant may instead be used. In an embodiment, the dopant concentration may comprise 1×10¹⁹ to 5×10²⁰ at/cm³. The InGaAs/Si material may exhibit superior electron mobility in comparison to strained silicon.

A layer 136 of sacrificial material is then deposited over the wafer. The layer 136 covers the epitaxial regions 30 and 32 and the STI structures 18. If the layer 136 as deposited does not have a planar top surface, a conventional chemical-mechanical polishing (CMP) technique may be used to provide a planar top surface. The layer 136 may, for example, have a thickness of 40-400 nm. The layer 136 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 136 may, for example, comprise doped or undoped polysilicon. The result is shown in FIG. 42.

Using conventional lithographic processing techniques, the layer 136 is patterned to define a dummy gate 144 at each active region. The dummy gates 144 may, for example, be formed using a reactive ion etch (RIE). The dummy gates 144 may have a length of 10-80 nm and a width of 10-80 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 43.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 148 on the side walls of each dummy gate 144. The result is shown in FIG. 44. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 148 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A layer 138 of dielectric material is then deposited over the wafer. The layer 138 covers the dummy gates 144, sidewall spacers 148, the epitaxial regions 30 and 32 and the STI structures 18. The layer 138 may, for example, have a thickness of 40-400 nm. The layer 138 may be deposited using a chemical vapor deposition (CVD) process. The material used for layer 38 may, for example, comprise silicon dioxide. A conventional chemical-mechanical polishing (CMP) technique is used to remove excess portions of layer 138 and provide a planar top surface coincident with the top of the dummy gate 144. The result is shown in FIG. 45.

The dummy gate 144 is then selectively removed using a reactive ion etch (RIE) or wet etch or combination process to form openings 150. The result is shown in FIG. 46.

A directional etch, such as a reactive ion etch (RIE), is then performed to extend the opening 150 as opening 150 a through the epitaxial regions 30 and 32 stopping on the semiconductor layers 16 p and 16 n (such that sides of opening 150 a are aligned with sides of opening 150). The result is shown in FIG. 47 as producing, from the epitaxial regions 30 and 32, a source epitaxial region on one side of the opening 150 a and a drain epitaxial region on the opposite side of the opening 150 a. The source and drain epitaxial regions are generally indicated at reference 52.

A laser annealing process is then performed to combine the source and drain epitaxial regions 52 and an underlying portion of the semiconductor layers 16 p and 16 n together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping to form regions 60 of single crystal material. The portions of the semiconductor layers 16 p and 16 n that remain after anneal define channel regions 62. The result is shown in FIG. 48. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In a preferred implementation, the portions of the semiconductor layers 16 p and 16 n below the epitaxial regions 30 and 32 are fully converted to single crystal throughout their thickness to the upper surface of the insulating layer 14. The p-n junction with the channel region in the semiconductor layers 16 p and 16 n is defined by a substantially vertical junction interface portion 64 extending for a depth less than the thickness of layer 16 and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than five degrees with respect to a straight line extending perpendicular to a rear surface of the substrate 10.

The openings 150 and 150 a are then filled with the gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 49. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that sidewall spacer 148 sits on top of the raised source-drain regions 60. In other words, a bottom-most surface of the sidewall spacer 148 is in contact with a top-most surface of the raised source-drain regions 60. The opening 150 a permits the gate electrode (defined by metal 74/76) to penetrate to a depth below the top-most surface of the raised source-regions. In this area of penetration, the gate electrode is insulated from the raised source-drain regions 60, both laterally and vertically, solely by the high-K dielectric layer 72.

In an embodiment, the insulating layer 14 may be selectively removed to produce cavities (like the cavities 130 and 132 discussed above) under the regions 16 p and 16 n.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

The CMOS transistor circuits shown in FIGS. 20 and 49 present a number of advantages including: a) a single inner spacer for both the PMOS and the NMOS with relatively large gate metal contact area; b) a low resistance extension with the thick epitaxial regions; c) a fully strained channel with high carrier mobility; d) formation of the raised source-drain regions before gate patterning provide uniform raised source-drain across various different pitches and simplifies dual epitaxial integration; and e) good control of channel thickness with respect to the SOI substrate (which can be of the extremely thin silicon on insulator (ETSOI) or ultra-thin body and BOX (UTBB) type known in the art).

Reference is now made to FIGS. 50-55 which illustrate the process steps in the formation of CMOS devices with sharp junctions between the source-drain region and the channel region. It will be understood that the drawings do not necessarily show features drawn to scale.

FIG. 50 shows a silicon on insulator (SOI) semiconductor substrate 10 comprising a semiconductor substrate 12, an insulating layer 14 and a semiconductor layer 16 in a stack of a wafer. The semiconductor layer 16 may, for example, have a thickness of 10-100 nm. The insulating layer 14 is commonly referred to in the art as a buried oxide (BOX) layer. The semiconductor layer 16 is strained as needed for high mobility performance (for example, in accordance with the technique described above in connection with FIGS. 1-12 to provide layers 112 and 122 b). Shallow trench isolation (STI) structures 18 are provided to delimit active areas of the substrate 10. The substrate 10 includes a first active area 20 reserved for the formation of first polarity (for example, p-channel) metal oxide semiconductor devices (PMOS) and a second active area 22 reserved for the formation of second, opposite, polarity (for example, n-channel) metal oxide semiconductor devices (NMOS). The STI structures 18 may be provided to extend with an exposed height of 5-50 nm above the top surface of the semiconductor layer 16. The provision of the STI structures 18 divides the semiconductor layer 16 in accordance with the active areas to provide a semiconductor layer 16 p (see, also, layer 112) for the PMOS devices and a semiconductor layer 16 n (see, also, layer 122 b) for the NMOS devices. In an embodiment, the semiconductor layer 16 p may comprise a germanium material, a silicon material, or a silicon germanium material. The semiconductor layer 16 n may comprise a silicon material. The semiconductor layers 16 p and 16 n may be doped as desired for the transistor application.

An epitaxial growth process is then performed to grow an epitaxial silicon-germanium (SiGeB) region 30 on the semiconductor layer 16 p and grow an epitaxial silicon or silicon carbon region (SiP/Si:CP) 32 on the semiconductor layer 16 n. The result is shown in FIG. 51. The regions 30 and 32 may, for example, have a thickness of 5-40 nm, and this thickness is preferably less than or equal to the exposed height of the STI structures 18. An in-situ Boron doped (ISBD) epitaxy may be used to form the epitaxial silicon-germanium region 30. The Boron dopant may be in the range of 1×10¹⁹ at/cm³ to 2×10²¹ at/cm³. Substitutional Germanium at 25% to 75% may be provided. An in-situ Phosphorous doped (ISPD) epitaxy may be used to form the epitaxial silicon or silicon-carbon region 32. The Phosphorous dopant may be in the range of 1×10¹⁹ at/cm³ to 1×10²¹ at/cm³. Substitutional Carbon at 0.5% to 5% may be provided.

As an alternative to strained silicon for the region 32, an epitaxial growth of indium-gallium-arsenic (InGaAs) may instead be made. The InGaAs region 32 may be doped with silicon (Si) using either an in situ process during epitaxy or an implant process after epitaxy. As an alternate to silicon dopant, any suitable Group IV (Ge or Sn) or Group VI (S, Se, Te) dopant may instead be used. In an embodiment, the dopant concentration may comprise 1×10¹⁹ to 5×10²⁰ at/cm³. The InGaAs/Si material may exhibit superior electron mobility in comparison to strained silicon.

Using conventional lithographic processing techniques, an opening 244 is formed in the epitaxial regions 30/32 at each active region stopping at the semiconductor layer 16. The opening 244 may, for example, be formed using a reactive ion etch (RIE). The opening 244 may have a length of 10-80 nm and a width of 10-60 nm, where length and width are used here in the same way as those terms are used in connection with a transistor structure such that the length refers to the dimension extending between the source and drain and the width refers to the dimension perpendicular thereto. The result is shown in FIG. 52 as producing, from the epitaxial regions 30 and 32, a source epitaxial region on one side of the opening 244 and a drain epitaxial region on the opposite side of the opening 244. The source and drain epitaxial regions are generally indicated at reference 52.

A conformal deposit of a layer of a low-K dielectric material is then made using an atomic layer deposition technique. The layer may have a thickness of approximately 2-20 nm. A directional etch, such as a reactive ion etch (RIE), is then performed to remove material from the horizontal surfaces and define a sidewall spacer 248 on the side walls of each opening 244. The result is shown in FIG. 53 with an opening 250 formed between opposite sidewall spacers 248. The opening 250 may, for example, have a length of 5-40 nm and a width of 5-40 nm. The low-K dielectric material may, for example, comprise SiN, SiBCN or SiOCN. The etch used to shape the sidewall spacers 248 and define opening 150 may, for example, comprise a Lam mixed mode pulsing (MMP) deposition/etch/O₂ flash approach.

A laser annealing process is then performed to combine the source and drain epitaxial regions 52 and an underlying portion of the semiconductor layers 16 p and 16 n together to form transistor source-drain regions 60. As an example, an Ultratech LXA288 may be used with an anneal temperature in a range from 800-1300° C. and a dwell time of 200-1600 μs. The laser annealing process advantageously allows for a uniform distribution of dopant within the junction, exceeding the rapid thermal processing (RTP) solubility limit and decreasing electrical resistance in the junctions by an order of magnitude. The laser annealing process functionally converts amorphous or polycrystalline material formed by previous dopant implants or epitaxial doping to form regions 60 of single crystal material. The portions of the semiconductor layers 16 p and 16 n that remain after anneal define channel regions 62. The result is shown in FIG. 54. The channel region may, for example, have a length of 1-20 nm extending between the locations of sharply defined junctions with the source-drain regions 60. The sharply defined junctions are obtained by controlling both the epitaxial layer thickness and dopant concentration as well as the temperature and dwell time of the anneal. The junction will exhibit a greatly reduced junction electrical resistance with better control over the local dopant diffusion profile than with RTP.

In an preferred implementation, the portions of the semiconductor layers 16 p and 16 n below the epitaxial regions 30 and 32 are fully converted to single crystal throughout their thickness to the upper surface of the insulating layer 14. The p-n junction with the channel region in the semiconductor layers 16 p and 16 n is defined by a substantially vertical junction interface portion 64 extending for a depth less than the layer 16 thickness and a sloped junction interface portion 66 extending from the substantially vertical junction interface portion in a direction away from the channel region 62. In this context, the junction interface portion 64 is substantially vertical in that a straight line connecting ends of the junction interface portion 64 forms an angle of less than five degrees with respect to a straight line extending perpendicular to a rear surface of the substrate 10.

The opening 250 is then filled with the gate stack 70 comprising a high-K dielectric layer 72, a metal liner 74 and a metal fill 76. A conventional chemical-mechanical polishing (CMP) technique is used to eliminate excess material and provide a planar top surface. The result is shown in FIG. 55. The material for the high-K dielectric layer 72 may, for example, comprise HfO₂ deposited using atomic layer deposition (ALD) with a thickness of 1-10 nm. The material for the metal liner 74 may, for example, comprise TiN deposited using atomic layer deposition (ALD) with a thickness of 2-6 nm. The material for the metal fill 76 may, for example, comprise Tungsten deposited using chemical vapor deposition (CVD) with a thickness of 100-200 nm.

From a structural perspective, it will be noted that sidewall spacer 248 laterally (horizontally) separates the gate electrode (defined by metal 74/76) from the raised source-drain regions 60. In this configuration, a bottom-most surface of the sidewall spacer 248 is in contact with an intermediate surface of the source-drain regions 60 (defined by opening 250), said intermediate surface being between a top-most surface and bottom-most surface of the source-drain regions. Furthermore, with opening 250, the gate electrode is vertically separated (insulated) from the raised source-drain regions 60 at said intermediate surface by only the high-K dielectric layer 72.

In an embodiment, the insulating layer 14 may be selectively removed to produce cavities (like the cavities 130 and 132 discussed above) under the regions 16 p and 16 n.

At this point, front end of line (FEOL) fabrication of the integrated circuit is complete. Further back end of line (BEOL) processing to fabricate metallizations and interconnects may then be performed as well known to those skilled in the art.

The CMOS transistor circuits shown in FIGS. 31 and 55 present a number of advantages including: a) a single inner spacer for both the PMOS and the NMOS with relatively large gate metal contact area; b) a low resistance extension with the thick epitaxial regions; c) a fully strained channel with high carrier mobility; d) formation of the raised source-drain regions before gate patterning provide uniform raised source-drain across various different pitches and simplifies dual epitaxial integration; and e) good control of channel thickness with respect to the SOI substrate (which can be of the extremely thin silicon on insulator (ETSOI) or ultra-thin body and BOX (UTBB) type known in the art).

The foregoing description has provided by way of exemplary and non-limiting examples a full and informative description of the exemplary embodiment of this invention. However, various modifications and adaptations may become apparent to those skilled in the relevant arts in view of the foregoing description, when read in conjunction with the accompanying drawings and the appended claims. However, all such and similar modifications of the teachings of this invention will still fall within the scope of this invention as defined in the appended claims. 

What is claimed is:
 1. A method, comprising: on a bulk substrate, repeating epitaxial processes to grow a first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers; epitaxially growing a defect free and fully stress released semiconductor layer on top of an uppermost one of the semiconductor defect cap layers in the first stack, the defect free and fully stress released semiconductor layer having a first thickness; on the defect free and fully stress released semiconductor layer, repeating epitaxial processes to grow a second stack of alternating indium-phosphorous and indium-gallium-arsenic layers; epitaxially growing a further indium-gallium-arsenic layer on top of an uppermost one of the indium-gallium-arsenic layers in the second stack; doping the further indium-gallium-arsenic layer with a Group IV or Group VI dopant; and removing at least one of the indium-phosphorous layers in the second stack to form a cavity underneath the uppermost one of the indium-gallium-arsenic layers.
 2. The method of claim 1, further comprising: forming a transistor source and a transistor drain of a transistor from the further indium-gallium-arsenic layer and the uppermost one of the indium-gallium-arsenic layers; and forming a channel region of the transistor from the uppermost one of the indium-gallium-arsenic layers.
 3. The method of claim 2, wherein forming the transistor source and the transistor drain comprises: forming an opening extending through the further indium-gallium-arsenic layer to define a source region and a drain region; performing an anneal of the source region and a portion of the uppermost one of the indium-gallium-arsenic layers below the source region to form said transistor source; and performing an anneal of the drain region and a portion of the uppermost one of the indium-gallium-arsenic layers below the drain region to form said transistor drain.
 4. The method of claim 3, further comprising forming a gate structure for the transistor in said opening.
 5. The method of claim 1, wherein the first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers includes at least two semiconductor stress release buffer layers and two semiconductor defect cap layers.
 6. The method of claim 1, wherein each semiconductor stress release buffer layer is made of silicon-germanium and each semiconductor defect cap layer is made of silicon.
 7. The method of claim 1, wherein the second stack of alternating indium-phosphorous and indium-gallium-arsenic layers includes at least two indium-phosphorous layers and two indium-gallium-arsenic layers.
 8. The method of claim 1, further comprising: bonding a wafer to an upper surface of the defect free and fully stress released semiconductor layer, said wafer comprising an insulator layer and a semiconductor layer, wherein the insulator layer is bonded to the defect free and fully stress released semiconductor layer.
 9. The method of claim 8, further comprising: in a first region, removing a portion of the wafer to expose a portion of the defect free and fully stress released semiconductor layer; wherein the step of repeating epitaxial processes to grow the second stack of alternating indium-phosphorous and indium-gallium-arsenic layers is performed from the exposed portion of the defect free and fully stress released semiconductor layer.
 10. The method of claim 9, wherein removing the portion further comprises reducing a thickness of the defect free and fully stress released semiconductor layer in said first region to produce the exposed portion of the defect free and fully stress released semiconductor layer.
 11. The method of claim 8, further comprising epitaxially growing a doped silicon germanium layer on the semiconductor layer of said wafer.
 12. The method of claim 11, further comprising removing the insulator layer of said wafer to form a cavity underneath the semiconductor layer of said wafer.
 13. The method of claim 12, further comprising: forming a transistor source and a transistor drain of a transistor from the doped silicon germanium layer and the semiconductor layer; and forming a channel region of the transistor from the semiconductor layer.
 14. The method of claim 13, wherein forming the transistor source and the transistor drain comprises: forming an opening extending through the doped silicon germanium layer to define a source region and a drain region; performing an anneal of the source region and a portion of the semiconductor layer below the source region to form said transistor source; and performing an anneal of the drain region and a portion of the semiconductors below the drain region to form said transistor drain.
 15. The method of claim 14, further comprising forming a gate structure for the transistor in said opening.
 16. The method of claim 1, wherein the Group IV dopant for the further indium-gallium-arsenic layer is silicon.
 17. The method of claim 1, wherein the Group IV dopant for the further indium-gallium-arsenic layer is selected from the group consisting of Ge and Sn.
 18. The method of claim 1, wherein the Group VI dopant for the further indium-gallium-arsenic layer is selected from the group consisting of S, Se and Te.
 19. A method, comprising: on a bulk substrate, repeating epitaxial processes to grow a first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers; epitaxially growing a defect free and fully stress released semiconductor layer on top of an uppermost one of the semiconductor defect cap layers in the first stack, the defect free and fully stress released semiconductor layer having a first thickness; on the defect free and fully stress released semiconductor layer, repeating epitaxial processes to grow a second stack of alternating indium-phosphorous and indium-gallium-arsenic layers; epitaxially growing a strained silicon layer on top of an uppermost one of the indium-gallium-arsenic layers in the second stack; doping the strained silicon layer; and removing at least one of the indium-phosphorous layers in the second stack to form a cavity underneath the uppermost one of the indium-gallium-arsenic layers.
 20. The method of claim 19, further comprising: forming a transistor source and a transistor drain of a transistor from the strained silicon layer and the uppermost one of the indium-gallium-arsenic layers; and forming a channel region of the transistor from the uppermost one of the indium-gallium-arsenic layers.
 21. The method of claim 20, wherein forming the transistor source and the transistor drain comprises: forming an opening extending through the strained silicon layer to define a source region and a drain region; performing an anneal of the source region and a portion of the uppermost one of the indium-gallium-arsenic layers below the source region to form said transistor source; and performing an anneal of the drain region and a portion of the uppermost one of the indium-gallium-arsenic layers below the drain region to form said transistor drain.
 22. The method of claim 21, further comprising forming a gate structure for the transistor in said opening.
 23. The method of claim 19, wherein the first stack of alternating semiconductor stress release buffer and semiconductor defect cap layers includes at least two semiconductor stress release buffer layers and two semiconductor defect cap layers.
 24. The method of claim 19, wherein each semiconductor stress release buffer layer is made of silicon-germanium and each semiconductor defect cap layer is made of silicon.
 25. The method of claim 19, wherein the second stack of alternating indium-phosphorous and indium-gallium-arsenic layers includes at least two indium-phosphorous layers and two indium-gallium-arsenic layers.
 26. The method of claim 19, further comprising: bonding a wafer to an upper surface of the defect free and fully stress released semiconductor layer, said wafer comprising an insulator layer and a semiconductor layer, wherein the insulator layer is bonded to the defect free and fully stress released semiconductor layer.
 27. The method of claim 26, further comprising: in a first region, removing a portion of the wafer to expose a portion of the defect free and fully stress released semiconductor layer; wherein the step of repeating epitaxial processes to grow the second stack of alternating indium-phosphorous and indium-gallium-arsenic layers is performed from the exposed portion of the defect free and fully stress released semiconductor layer.
 28. The method of claim 27, wherein removing the portion further comprises reducing a thickness of the defect free and fully stress released semiconductor layer in said first region to produce the exposed portion of the defect free and fully stress released semiconductor layer.
 29. The method of claim 26, further comprising epitaxially growing a doped silicon germanium layer on the semiconductor layer of said wafer.
 30. The method of claim 29, further comprising removing the insulator layer of said wafer to form a cavity underneath the semiconductor layer of said wafer.
 31. The method of claim 30, further comprising: forming a transistor source and a transistor drain of a transistor from the doped silicon germanium layer and the semiconductor layer; and forming a channel region of the transistor from the semiconductor layer.
 32. The method of claim 31, wherein forming the transistor source and the transistor drain comprises: forming an opening extending through the doped silicon germanium layer to define a source region and a drain region; performing an anneal of the source region and a portion of the semiconductor layer below the source region to form said transistor source; and performing an anneal of the drain region and a portion of the semiconductors below the drain region to form said transistor drain.
 33. The method of claim 32, further comprising forming a gate structure for the transistor in said opening.
 34. The method of claim 19, wherein a dopant for the strained silicon layer is phosphorous. 